Japan's "Procedural Packaging Association" recently successfully prototyped SiP using inkjet technology to package ICs and passive components, which is the world's first.
A fine metal material, an insulating material, or the like is mixed with a solvent to prepare a liquid, which is sprayed using an inkjet technique to form a wiring between the IC and the passive device and an insulating film between the wiring layers. Since the ink jet technology is used for production, an exposure program using a mask can be omitted, so it is suitable for a variety of products and a small amount of production.